PCB & Layout
Thickness: 1.6mm
Options: Hotswap or Solder
Firmware: QMK/VIA supported
MCU: TBA
ISO support, split backspace, 6.25 R4 (solder only)
Materials
Case: Aluminum 6063 or Polycarbonate
Middle Piece: Sandblasted Aluminum 6063, Polycarbonate, Copper or Brass
Weight: PVD Stainless Steel, Sandblasted Copper or Brass
Plate: POM, FR4, Aluminum, Carbon Fiber, Polycarbonate