PCB & Layout
Thickness: 1.6mm
Options: Hotswap or Solder
Firmware: QMK/VIA supported
MCU: TBA
ISO support, split backspace, 6.25 R4 (solder only)
Materials
Case: Aluminum 6063 or Polycarbonate
Weight: PVD Stainless Steel or Sandblasted Copper
Plate: POM, FR4, Aluminum, Carbon Fiber, Polycarbonate